• Drive the development and maintenance of automation scripts and tools for Substrate, Interposer, and Silicon Bridge design flows.
• Deploy AI/ML methodologies to optimize critical design stages, including auto-routing, component placement, and signal integrity optimization.
• Collaborate with EDA vendors and internal stakeholders to define and implement next-generation feature roadmaps for 2.5D and 3D packaging.
• Lead the transition from manual design practices to "Agentic" and algorithmic design operational models.
• Coordinate with electrical and mechanical analysis teams to build closed-loop optimization systems that feed simulation results back into design construction.
• Prepare & present Executive Summaries of automation ROI, efficiency gains, and tool capability advancements.
• Coordination of activities within/external teams to deliver critical design tape-outs and methodology milestones.
• Mentoring junior engineers in coding best practices and advanced packaging concepts.

• Strong knowledge of EDA packaging design tools (Cadence APD/SIP, Siemens Xpedition, or Synopsys 3DIC/Compiler).
• Proven track record of developing automation using Python, Tcl, SKILL, or C++.
• Experience with applying AI/ML frameworks (PyTorch, TensorFlow, etc.) to engineering or design problems.
• Familiarity with Advanced Packaging architectures (2.5D/3D, Chiplets, Fan-Out, Hybrid Bonding).
• Familiar with design verification flows (DRC/LVS) and electrical extraction concepts.
• Good leadership and interpersonal skills.

• Bachelor/MS degree in Electrical Engineering, Computer Engineering, Computer Science, or related field with relevant packaging experience.

This role is not eligible for Visa Sponsorship

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