I applied through college or university. The process took 4 weeks. I interviewed at Apple (Shanghai, Shanghai) in Apr 2025
Interview
For Mac group (Graduate position)：
1. HR: general question, why apple, your strength..
2.Engineer group interview: prepare a presentation for your project and deepdive
3. Technical deep dive (3* 1h): general engineering question such as heat transfer, GD&T, cantilever beam.
Interview questions [1]
Question 1
Q: How to reduce deflection of a cantilever beam?
Q: What if I unload a specimen in a tensile test? (elastic/plastic region)?
Q: How do tolerances stack up?
The interview process consisted of an initial recruiter screen followed by a hiring manager conversation and multiple team interviews. The process was fairly structured and straightforward, with each stage building on the previous one. The final round included several back-to-back sessions that covered portfolio deep dives, design thinking, and collaboration. Everyone I spoke with was professional, thoughtful, and asked in-depth questions that pushed on both craft and problem-solving.
Interview questions [1]
Question 1
Tell me about a project where you had to design for multiple iterations
Interview went well nothing strange. I was impressed at the general structure of the interview. I also like the vibe of the interviewer, That's all I have to say about that.
5-6 rounds of interview, design challenge, plenty of tech questions on mechanical basics. The first round was 30 min phone call, then tech interviews with managers, then a design challenge and group interview. The rest depends on team I feel like.