I applied through college or university. The process took 4 weeks. I interviewed at HP Inc. (Singapore) in Mar 2021
Interview
It was ok, not too stressful. Questions asked are all ok, not too hard to answer. The interview was done through zoom, whenever i asked a question regarding the job was able to get the answer.
I applied online. The process took 4 weeks. I interviewed at HP Inc. (Ness Ziona) in Jun 2025
Interview
First telephone interview (very nice from an external agency. she was in contact all the time)
1 interview with the team leader (background+technical). nice guy
1 interview with the engineering manager (background+technical).
An external agency takes the responsibility for the first 9-month contract
Interview questions [1]
Question 1
Assemble this device.
drawings
solve current technical problems
I applied through an employee referral. The process took 1 day. I interviewed at HP Inc. (Vancouver, WA) in Aug 2016
Interview
An initial telephone interview to assess technical skills and level of experience.
Secondary interview involved meeting with a number of individuals from the technical engineering team to both further assess skill set in depth and discuss details of the role. Interview included technical problem solving and practical engineering problems relevant to the position.
Interview questions [1]
Question 1
A component from an electro-mechanical device was presented and the candidate needed to discuss the primary function as well as the fabrication process(es) used in the manufacturing of the item. Suggestions of how it may be improved from a design perspective and/or produced more cost effectively were also solicited.
