Check out your Company Bowl for anonymous work chats.
Integrity is built through consistent actions. Lam has been recognized by Ethisphere as one of the World’s Most Ethical Companies for the fourth consecutive year.
We are expanding in Boise, Idaho to improve support for advanced DRAM as AI drives new memory needs.
Not every chip on a wafer behaves the same, and even small variations can impact yield. Our latest Semiverse Solutions article breaks down how engineers use virtual fabrication to understand why these differences happen and how to fix them. We take a clear look at how data, modeling, and smarter process choices are improving device performance across the entire wafer!
Lam once again appears on Fortune’s World’s Most Admired Companies list – recognized for our culture, reputation, and overall performance. The ranking reflects input from industry peers on leadership, innovation, and responsibility.
Explore how silicon photonics, replacing copper interconnects with light-based data transmission, will drive the next wave of AI advancement.
Packaging complexity changes the requirements for dielectric deposition. Ming Li, vice president of strategic projects (dielectrics) in our Deposition Product Group, joins Silicon Semiconductor to walk through the thinking behind VECTOR®️ TEOS 3D. Learn more in the full video.
Advanced memory scaling opens the door to metals that weren’t viable a generation ago. In this Semiconductor Engineering article, Lam experts share how advanced deposition and grain-control techniques make molybdenum manufacturable — enabling barrierless integration and tighter memory architectures.
AI is increasingly used to support decision-making across semiconductor manufacturing. At Lam, digital twins combine process data, physics-based models, and machine learning to enable faster optimization across complex process flows. Semiconductor Engineering explains more.
Our team in Tualatin, Oregon, was hard at work developing the industry’s latest deposition tool designed for advanced packaging: VECTOR® TEOS 3D. Discover how this breakthrough came to life — and meet the experts behind its development.
As logic devices shrink, voltage loss grows. Our Semiverse® Solutions team put two backside power delivery architectures, direct backside contact (DBC) and self-aligned backside contact (SABC), to the test in a virtual study. The result: SABC shows stronger tolerance to manufacturing variation and a larger process window for advanced gate-all-around (GAA) nodes. Get the full breakdown in the blog post.
