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Furthering our commitment to I&D, Lam introduced a robust set of programs to ensure that we’re building a culture in which every employee feels valued, included and empowered to reach their full potential. Our latest blog shares a few key takeaways from our Global Diversity Awareness Month efforts:
We are a proud platinum sponsor of the 22nd Electronics Packaging Technology Conference (EPTC), happening virtually today and tomorrow (12/2-12/3). This is an excellent opportunity to hear from industry leaders, including Manish Ranjan from our team, on the future of electronic packaging. For schedule and registration information, visit our blog:
For years, chemical vapor deposition, diffusion/furnace, and spin-on processes have enabled gapfill in semiconductor manufacturing, yet these legacy gapfill technologies introduce limitations as memory devices advance. Our VP and GM of dielectric atomic layer deposition (ALD) products, Aaron Fellis, explains how enhanced ALD platforms, such as Striker® FE, address these limitations:
Financial technology, or FinTech, removes barriers to entry from personal finance by providing applications specifically designed for budgeting, investing, managing income/expenses, and more. Advanced microprocessors and memory chips allow for increased speeds, data storage capabilities, battery power, and security in all FinTech apps.
Education is key to the advancement of our communities and industry. Helping students succeed, Lam Korea and Taiwan work with local universities to provide students with semiconductor-related textbooks, fostering awareness and interest in opportunities in the STEM fields. Check out our most recent blog post to learn more:
By hosting tours, trainings, and workshops throughout the year, we aim to demonstrate just how exciting a career in STEM can be to the next generation. Learn more in our most recent blog:
Thrilled to share that we earned a spot on the 2020 Forbes’ World’s Best Employers list. We would like to thank our employees, as they are integral to our supportive, collaborative, innovative, and inclusive work environment.
Despite all of the uncertainty and unexpected roadblocks this year, our top-tier team of suppliers continually thought outside of the box to ensure access to necessary materials. Six suppliers in particular demonstrated agility and resilience - view the recipients of our 2020 Supplier Excellence Awards in our blog:
At the 22 nm node level, finFETs revolutionized building processes for transistors, yet as scaling shifts to 5- and 3-nm nodes, gate-all-around, or GAA, transistors are necessary to ensure current and control. Our latest blog post outlines both the past and future of transistor scaling technology.
Virtual fabrication is the key to cutting costs and time-to-market for chips of the future. Virtual fabs accomplish this by offering statistical insights into designs, defects, and yields, providing results with efficiency and quality. We dive into the applications of this tech via our most recent blog post.
