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As demand for gallium nitride (GaN) grows in power and RF applications, Si (silicon) and SiC (silicon carbide) companies eager to enter this emerging market face challenges in achieving mass production. Learn how our etch, deposition, and clean solutions enable high-volume manufacturing for power and RF GaN applications.
We honored nine of our top-performing suppliers with the 2024 Supplier Excellence Award at our Supplier Day event! Recipients were acknowledged for excelling in one of five categories such as ESG, Operational Execution, Quality, Rapid Prototype Materials Performance, and New Product Introduction Performance. Explore the full list of recipients.
Will innovations in etching technology, like Lam Cryo 3.0, be the key to enabling 1,000-layer 3D NAND by the end of the decade? Find out in a recent article from EE Times Asia.
The groundbreaking new systems lab at our India Center for Engineering (ICE) in Bengaluru marks a significant milestone. Discover how this facility contributes to the growth of the semiconductor industry in Asia.
High bandwidth memory plays a critical role in enabling Gen AI. Get an inside look at the innovations that make HBM manufacturing possible via TECHnalysis Research.
Using digital twins and threads, engineers leverage virtual representations and data insights to optimize processes and equipment, accelerate innovation, and meet industry standards. Explore how digital twins enable faster design, deployment, and maintenance of leading-edge equipment and processes.
Our Senior Director of Advanced Packaging Chee Ping Lee dives into our latest innovations across the 2.5D and 3D packaging space in a recent TechArena podcast. Give it a listen!
Are you familiar with the three major markets powering our everyday digital devices? Read the blog to get a breakdown of each semiconductor market and our role in supporting our customers.
While the industry expects 1000-layer 3D NAND by the end of the decade, scaling beyond 400 layers brings significant challenges, such as slow etch rates, vertical profile variability, and more. Our advanced etching technologies, such as Lam Cryo™ 3.0, will be crucial for overcoming scaling challenges associated with 1000-layer 3D NAND. Explore what’s next with Counterpoint Research.
Introducing Lam Cryo™ 3.0 — our latest breakthrough in etch technology. Discover how this technological advancement serves as a testament to our commitment to innovation, customer success, and more.
