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How do we tackle the ever-increasing demand for global data storage and faster data transfers? With the launch of Lam Cryo™ 3.0 we are pushing the boundaries of HAR etch technology to enable the path to 1,000-layer 3D NAND to meet the needs of the AI era head on.
Our Equipment Intelligence® Solutions took home the 2024 Innovative Product of the Year Award for AI and Machine Learning!
The path to 1,000-layer 3D NAND is more than an aspiration; it’s a necessity driven by the increasing demands of AI. As a leader in etch and deposition technology, we’re committed to delivering innovations for even the most complex challenges associated with 3D NAND scaling. Learn why etching will be key to meeting future demands for global data processing and storage.
3D NAND memory capacity, dependent on the number of oxide and nitride layers, begins with etching near-perfect cylindrical holes. The challenge of etching these deep and precise high aspect ratio (HAR) holes increases with the number of layers. Our solution? Pulsed power plasma technology innovations and cryogenic etching. With 1,000-layer 3D NAND projected by the end of the decade, discover why these etching breakthroughs are key to enabling the scaling 3D NAND for the AI era.
With conventional DRAM devices becoming smaller, an increase in parasitic capacitance significantly hinders performance. To evaluate parasitic capacitance between the 6F2 and 4F2 DRAM devices, we leveraged our SEMulator3D® platform. Discover why 4F2 DRAM will be the architecture of choice.
We’re heading to San Francisco for #SEMICONWest from July 9 to 11! Join us to explore innovations transforming the semiconductor industry, network with industry leaders, and more.
As a company dedicated to acting with purpose for a better world, we’re proud to share our 2023 Environmental, Social, and Governance (ESG) report. Explore more.
High-bandwidth memory (HBM) promises new levels of performance and efficiency, shaping the future of high-performance computing. Discover how our advanced packaging technology will unlock new possibilities in AI via TechArena.
With 20+ years at Lam, Keren Kanarik, our technical managing director, will join SEMI’s Industry Strategy Symposium (ISS) planning committee. Her thought leadership propelled us to the forefront of the industry, supported by her prominent publications, peer-reviewed papers, and more. Read about Keren’s journey to success.
To create the complex circuit patterns of modern-day silicon chips, wafers undergo a process called etching. Learn more about the process and explore the products we offer for etch systems.
