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The Lam Capital Competition brought dozens of startups from around the world to our Fremont headquarters. Centered on the theme "Enabling Future Semiconductors," the competition provided a platform for startups to showcase how their innovations revolutionize the semiconductor ecosystem.
As High Bandwidth Memory (HBM) stacks become widely adopted to meet #AI demands, through-silicon vias (TSVs) will become even more critical to scale. Learn why the creation of precise TSV structures is essential and how Lam is helping chipmakers address scaling challenges from Aaron Fellis, via 3D InCites.
By leveraging virtual fabrication, we conducted 1500+ virtual experiments to investigate whether deposition/etch cycling can improve line edge roughness (LER) in chip manufacturing. Learn how this process could be a game changer for advanced logic and memory devices of the future.
We bring together best-in-class researchers, equipment, and solutions to drive advanced packaging forward and ensure commercial success. Explore our progress in developing 3D semi structures and how it’ll reshape the next generation of chip manufacturing.
A recent report published by SEMI and Nasdaq states ensuring climate resilience of the value chain is a business imperative for semiconductor companies. Read about the importance of climate resilient strategies, as well as how we built an ESG governance structure to meet our climate-related goals.
In honor of #EarthMonth and beyond, Lam integrates sustainability into all our existing systems. From how we source materials to designing energy-saving technologies, we set science-based targets to decrease emissions and combat climate change. Read more.
For the second year in a row, Forbes named us one of the best employers for diversity. This milestone highlights our commitment to fostering a culture of diversity and inclusion—uncover career opportunities at Lam.
Honesty, integrity, accountability, respect, and trust underpin everything we do at Lam, and we are grateful to be recognized by Ethisphere as one of the 2024 World's Most Ethical Companies. Read more on the blog.
Being the only person of color in a classroom or workplace can feel isolating, but Senior Product Engineer Theron Smith doesn’t let that discourage him. Learn more about why Theron is so motivated to increase diversity in STEM fields and how a career at Lam allows him to do so.
Optically based measurement technologies face challenges as chip manufacturers begin adopting scaling approaches that stack components vertically. The solution? Our mass metrology tool Metior® is capable of measuring thick film stacks, high aspect ratios, and buried etched features. Explore the advantages and applications on the blog.