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Curious about advanced packaging and its role in the semiconductor industry? On the blog, we break down the basics of advanced packaging — a key driver of microchip performance and efficiency. Learn how techniques like 3D stacking and chiplet-based solutions enable smaller and more powerful chips.
AI relies on memory engineered for speed and scale. High bandwidth memory (HBM) stacks layers and connects them with microscopic precision — and we provide the tools to make it possible. Learn more via the blog.
Molybdenum (Mo) hybrid metallization cuts via/line resistance by ~55% and reduces stress-induced voids, improving BEOL reliability. Using virtual fabrication and simulation, we mapped the optimal Mo via profiles to maximize performance without costly wafer experiments. Get the full rundown via the blog.
Ultra-thick dielectric films are essential for today’s 3D chip architectures, but they come with challenges like cracks, voids, wafer bowing, and throughput limits. Our deposition tool VECTOR® TEOS 3D solves these challenges with precision deposition technology built for advanced packaging. Learn how via our blog.
How do you scale 3D NAND to 1,000 layers while reducing environmental impact? Lam Cryo™ 3.0 uses cryogenic etch technology to create ultra-precise memory channels that deliver higher storage density, improved efficiency, and lower energy use for the AI era. Read more via Engineeringness.
Tualatin isn’t just where we work — it’s where we build lasting partnerships. From mentoring students to supporting local nonprofits, our commitment goes beyond technology. As we plan for our next chapter of growth, we’re committed to continuing to invest in the people and programs that make this community thrive. Learn more.
The next big thing in semiconductor metallization is here. CVP and GM of ALD/CVD Metals Products, Dr. Kaihan Ashtiani, explained the transition from tungsten to Mo and how our ALTUS® Halo tool overcomes the challenges associated with Mo deposition on the Silicon Semiconductor podcast. Give it a listen.
No fab? No problem. With Semiverse® Solutions, we help students across the U.S. learn chipmaking virtually — building skills for the future, without needing cleanroom access. See how we help bridge the talent gap via our blog.
What happens when 3D NAND layers stretch too far? We used SEMulator3D® to simulate stress-induced tier collapse — revealing how material properties like Young’s modulus can make or break device integrity. Read the full analysis.
Why molybdenum? Corporate VP & GM Dr. Kaihan Ashtiani joins Semiconductor Insiders to discuss the material and process innovations shaping next-gen devices. Listen now.
