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With Akara®, our customers achieve results once thought impossible. Learn how Akara® makes the next generation of advanced logic and memory technologies possible.
What makes an AI model useful in the fab? Corporate VP David Fried shares how we accelerate the development of AI-based equipment models using data and how these models guide real-world tool optimization via Semiconductor Engineering.
Building chips for AI means solving complex challenges — building new materials and ultra-precise manufacturing steps. Using molybdenum, we improve conductivity while simplifying the metallization process. Learn more.
Senior Vice President, Chief Technology and Sustainability Officer Vahid Vahedi breaks down how we design semiconductor solutions with lower energy use, fewer emissions, and smarter virtual processes that reduce waste at every step. It’s not just about checking the box — it’s about creating tools and technologies that help our customers meet their goals. See how our teams engineer practical solutions for a more sustainable future via the blog.
Did you know our state-of-the-art dry patterning solutions enable logic and DRAM scaling at the lowest cost by extending single-print EUV lithography to more advanced nodes? See how we tackle challenges associated with advanced patterning, such as edge placement errors, via the blog.
Did you know that switching from tungsten to molybdenum in chip interconnects can reduce contact resistance by up to 50%? In this Semiconductor Engineering article, Corporate VP & GM Dr. Kaihan Ashtiani explains how this shift improves performance and reliability for AI chips operating at extreme scales.
With Semiverse® Solutions, engineers can virtually visualize complicated 3D structures like never before. Read our blog post to see how virtual fabrication transforms semiconductor development.
Our collaborative robot Dextro™, a historic first in the semiconductor industry, won a Best of Sensors Award! We let Dextro™ shed light on this achievement in a recent blog post. Check it out.
Interested in learning more about the industry’s most advanced conductor etch technology, Akara®? Hear it straight from one of our experts in a conversation with Counterpoint Research. The conversation covers the challenges of 3D chipmaking, how Akara® overcomes them, and more. Watch now.
From learners to leaders, the first cohort of our Microscopy Technician Training Program just graduated! Through this program with Portland Community College, we help students gain hands-on experience with the same equipment used in advanced manufacturing. In just eight weeks, participants learned how to navigate complex imaging tools and apply that knowledge to real-world challenges. It’s all part of building a stronger, more skilled tech workforce in Oregon. Read the blog for more.
