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Next-generation device roadmaps demand direct-print 28nm pitch BEOL to enable scaling. Explore how our dry photoresist (dry resist) technology optimizes patterning by overcoming the well-known tradeoff between EUV exposure dose (cost) and defectivity (yield).
Diversity and inclusion fuel everything we do, and we’re thrilled to be recognized with the Human Rights Campaign Foundation’s 2025 Equality 100 Award — the highest possible rating for workplace equality. Explore more.
As part of our mission to reach net zero by 2050, we always seek sustainable alternatives to current R&D practices. Discover why virtual twins may be the answer despite their high energy requirements.
Did you know virtual twins can achieve the same results as physical tests but with far less carbon emissions? Find out how virtual twins and sustainability go hand in hand.
When we collaborate with universities, the possibilities are endless. Through our University Research programs, Lam engineers team up with faculty and students to collaboratively work on Lam-funded research projects in areas such as on-wafer materials and interfaces, plasma characterization and control, and increasing productivity and sustainability. Read the blog for more.
The fab of the future is here. Dextro™, our first collaborative robot (cobot) for semiconductor manufacturing, works alongside chipmakers to optimize precision, efficiency, cost, and repeatability in tool maintenance. Explore this groundbreaking technology. https://www.lamresearch.com/product/dextro/
The future of semiconductor fab maintenance is here. Introducing Dextro™, our new collaborative robot (cobot) driving efficiency in wafer fab equipment maintenance. Read the blog to find out how Dextro™ helps chipmakers save time, reduce costs, and improve yield.
In a recent study, we explore process parameters and corresponding process windows needed to deliver interconnect performance at 2nm and beyond. Here’s what we found. https://bit.ly/3CIBOhD
In a recent study, we used process modeling to improve etch variance caused by loading effects. Discover how this process helps engineers achieve a uniform, targeted etch result.
Our VizGlow® tool predicts the behavior of new designs and processes. With VizGlow® 3.1, engineers will see even greater accuracy — learn more.
